| PROCESSEUR D'APPLICATIONS |
STMicroelectronics STM32MP255F, Arm® 64-bit dual Cortex®-A35 at 1.5 GHz;
Cortex-M33 at 400 MHz with FPU/MPU;
Cortex M0+ at 200 MHz in SmartRun domain |
| MEMOIRE |
Up to 128 GB Flash (eMMC™), up to 2 GB DDR4 (16-bit) |
| PMIC |
STMicroelectronics Power Management IC — STPMIC25A |
| NPU / ISP |
Neural Processing Unit (NPU) — VeriSilicon® at 900 MHz, 1.35 TOPS |
| VIDÉO / GRAPHIQUES |
3D GPU — VeriSilicon at 900 MHz; OpenGL® ES 3.2.8 — Vulkan 1.2; Open CL™ 3.0, OpenVX™ 1.3; up to 138 Mtriangle/s, 900 Mpixel/s;
LCD-TFT controller, up to 24-bit digital RGB888; up to FHD (1920 x 1080) at 60 fps, 3 layers including a secure layer; YUV support, 90° output rotation;
MIPI DSI®, 4x data lanes, up to 2.5 Gbit/s each; up to QXGA (2048 x 1536) at 60 fps;
FPD-1 and OpenLDI JEIDA/VESA (LVDS), 1x link of 4x data lanes, up to 1.1 Gbit/s each, up to 1080p at 60 fps |
| CAMERA |
Camera interface #1 (5 Mpixels at 30 fps); MIPI CSI-2®, 2x data lanes up to 2.5 Gbit/s each; 8- to 16-bit parallel, up to 120 MHz; RGB, YUV, JPG, RawBayer with basic ISP, downscaling, cropping, 3-pixel pipelines;
Camera interface #2 (1 Mpixels at 15 fps); 8- to 14-bit parallel, up to 80 MHz; RGB, YUV, JPG, cropping;
Digital parallel interface up to 16-bit input or output |
| SÉCURITÉ |
Secure boot, TrustZone® peripherals, up to 8 tamper input pins + 8 active tamper output pins, 1x CRC calculation unit, 2x cryptographic processors, hardware acceleration with DMA support; environmental monitors, display secure layers;
Encryption/decryption: AES-128/192/256, DES/TDES; secure AES-256 with SCA; RSA, ECC, ECDSA with SCA; HASH (SHA-1, SHA-224, SHA-256, SHA3), HMAC; true random number generator; “on-the-fly” DDR encryption/decryption (AES-128); “on-the-fly” OTFDEC Octo-SPI flash memory decryption (AES-128);
Complete resource isolation framework;
Digi TrustFence embedded security framework |
| PÉRIPHÉRIQUES / INTERFACES |
8x I2C FM+ (1 Mbit/s, SMBus/PMBus®); 4x I3C (12.5 Mbit/s); 5x UART + 4x USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave);
8x SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock);
4x SAI (stereo audio: I2S, PDM, SPDIF Tx);
SPDIF Rx with 4 inputs;
3x SDMMC up to 8-bit, out of which one is used for eMMC and one for Wi-Fi;
up to 3x CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN);
1x USB 2.0 high-speed Host with embedded 480 Mbits/s PHY;
1x USB 2.0/3.0 high-speed/SuperSpeed dual role data with embedded 480 Mbits/s and 5 Gbits/s PHY (5 Gbits/s PHY shared with PCI Express);
1x USB Type-C® Power Delivery control with two CC lines PHY;
1x PCI Express with embedded 5 Gbits/s PHY (PHY shared with USB 3.0 SuperSpeed);
up to 172 secure I/O ports with interrupt capability; up to 6 wake-up inputs; up to 8 tamper input pins + 8 active tamper output pins;
3x ADCs with 12-bit max. resolution (up to 5 Msps each, up to 24 channels);
Internal temperature sensor;
1x multifunction digital filter (MDF) with up to 8 channels/8 filters;
1x audio digital filter with 1 filter and sound activity detection;
Internal or external ADC reference VREF+;
4x 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input;
3x 16-bit advanced motor control timers;
10x 16-bit general-purpose timers (including 2 basic timers without PWM);
5x 16-bit low-power timers;
Secure RTC with subsecond accuracy and hardware calendar;
up to 2x 4 Cortex-A35 system timers (secure, non-secure, virtual, hypervisor);
2x SysTick M33 timer (secure, non-secure);
1x SysTick M0+ timer;
7x watchdogs (5x independent and 2x window) |
| ETHERNET |
2x Gigabit Ethernet with external PHY interfaces, optional 3x Gigabit Ethernet GMAC interfaces and 2+1 switch with STM32MP257F MPU;
TSN, IEEE 1588v2 hardware, MII/RMII/RGMII |
| WIRELESS |
Wi-Fi 5 dual-band 802.11a/b/g/n/ac 1x1 radio (up to 433.3 Mbps) with strong WPA3-Enterprise authentication/encryption;
−40 °C to 85 °C (−40 °F to 185 °F) full temperature range; Bluetooth 5.2 (Basic Rate, Enhanced Data Rate and Bluetooth Low Energy) |
| TEMPÉRATURE DE FONCTIONNEMENT |
Industriel : De -40 °C à 85 °C (de -40 °F à 185 °F) ; selon le cas d'utilisation et la conception du boîtier/système. |
| TEMPÉRATURE DE STOCKAGE |
De -50 °C à 125 °C (de -58 °F à 257 °F) |
| HUMIDITÉ RELATIVE |
5% à 90% (sans condensation) |
| RADIO APPROVALS* |
États-Unis, Canada, Union européenne, Japon, Australie/Nouvelle-Zélande, Brésil, Mexique. |
| EMISSIONS/ IMMUNITY/ SAFETY* |
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024
EN 301 489-3, Safety (IEC 62368-1); visit product certifications for latest updates |
| DESIGN VERIFICATION* |
Température : IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 ; vibrations/chocs : IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
| MONTAGE / NOMBRE DE BRO DE MONTAGE |
Digi SMTplus (30 mm x 30 mm) surface mount footprint using 333-pad LGA (1.27 mm pitch) with option for simple carrier board designs supporting subset of interfaces |
| DIMENSIONS MÉCANIQUES |
30 mm x 30 mm x 3 mm (1.18 in x 1.18 in x 0.12 in) |
| GARANTIE DU PRODUIT |
3 ans |