Digi ConnectCore 93

Coming Soon

Embedded, wireless system-on-module based on the NXP i.MX 93 processor, with AI/ML NPU, designed for longevity and scalability in industrial IoT applications

 
  • Industrial i.MX 93 single/dual-core system-on-module
  • AI/ML Arm® Ethos U65 micro neural processing unit (NPU)
  • Pre-certified dual-band 802.11ax Wi-Fi and Bluetooth® 5.2
  • Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability
  • Superior power management with hardware and software support
  • Digi Microcontroller Assist™ for 2.5 µA ultra-low power mode
  • Seamless cellular modem and Digi XBee® integration
  • High level of pin-compatibility with Digi ConnectCore® 8 SOM family
  • Cloud and edge-compute services integration
  • Built-in device security, identity and privacy with Digi TrustFence®
  • Remote management with Digi ConnectCore® Cloud Services
  • Digi Embedded Yocto Linux® support

Digi ConnectCore® 93, based on the NXP® i.MX 93 application processor, is an integrated system-on-module (SOM) platform with wireless connectivity. The ConnectCore 93 SOM is designed for a wide range of medical, industrial, energy, and transportation applications, including Internet of Things (IoT), automation, human-machine interface (HMI), equipment monitoring, audio/voice, edge computing and machine learning (e.g. anomaly detection).

Digi ConnectCore 93 features up to two power-efficient Arm® Cortex®-A55 cores, with a Cortex-M33 core, AI/ML Arm Ethos U65 NPU and NXP PMIC for maximum power efficiency. This SOM is designed for industrial reliability and the 10+ year product lifecycles of embedded devices.

The ConnectCore SOM solution provides ready-to-use building blocks and a vast collection of development tools. This helps OEMs lower R&D and development costs, realize a lower total cost of ownership, and streamline time-to-market by leveraging pre-certified wireless connectivity, remote management, cloud integration and a complete, embedded Linux software platform based on Yocto Project®.

In addition, built in Digi TrustFence® enables OEM developers to integrate critical security and data privacy capabilities into their products.


TrustFenceYocto ProjectBluetoothWi-Fi AllianceNXP Gold PartnerPowered by AWS

 

Compare SOMs

Compare SOMs

Notify me of Digi ConnectCore 93 product updates

Kits
SKU: CC-WMX93-KIT Digi ConnectCore 93 Development Kit
  • Digi ConnectCore 93 development board with i.MX 93 dual-core, NPU, 8 GB eMMC, 1 GB LPDDR4 wireless SOM
CC-WMX93-KIT Coming Soon
Contact Us
Modules
SKU: CC-WMX-YC7D-KN Digi ConnectCore 93 System-On-Module — dual-core, NPU, wireless
  • NXP i.MX 93
  • 8 GB flash (eMMC)
  • 1 GB LPDDR4 / LPDDR4X
  • AI/ML Arm Ethos U65 micro neural processor
  • 2x Gigabit Ethernet
  • Wi-Fi 6 802.11ax
  • Bluetooth 5.2
  • 802.4.15
CC-WMX-YC7D-KN Coming Soon
Contact Us
SKU: CC-MX-YC7D-ZN Digi ConnectCore 93 System-On-Module — dual-core, NPU, Ethernet
  • NXP i.MX 93 
  • 8 GB flash (eMMC)
  • 1 GB LPDDR4 / LPDDR4X
  • AI/ML Arm Ethos U65 micro neural processor
  • 2x Gigabit Ethernet
CC-MX-YC7D-ZN Coming Soon
Contact Us
SKU: CC-WMX-ZC6D-L1 Digi ConnectCore 93 System-On-Module — single-core, wireless
  • NXP i.MX 93
  • 8 GB flash (eMMC)
  • 512 MB LPDDR4 / LPDDR4X
  • 2x Gigabit Ethernet
  • Wi-Fi 6 802.11ax
  • Bluetooth 5.2
  • 802.4.15
CC-WMX-ZC6D-L1 Coming Soon
Contact Us
SKU: CC-MX-ZC6D-Z1 Digi ConnectCore 93 System-On-Module — single-core, Ethernet
  • NXP i.MX 93
  • 8 GB flash (eMMC)
  • 512 MB LPDDR4 / LPDDR4X
  • 2x Gigabit Ethernet
CC-MX-ZC6D-Z1 Coming Soon
Contact Us
Accessories
SKU: CC-ACC-LCDH-10 LCD Application Kit, including 10 in WXGA (high resolution) LCD panel CC-ACC-LCDH-10 HOW TO BUY
Services and Support
Digi ConnectCore® Cloud Services enable OEMs in a wide range of industries to create connected devices with remote-dashboard, -service and -application capabilities using Digi ConnectCore system-on-modules (SOMs).   GET STARTED
Maintaining the security for connected devices after product release is challenging. Digi ConnectCore® Security Services enable customers to keep products secure.   GET STARTED
Support Services
Get the help you need to deploy, manage, connect, customize and enhance your Digi solution
  GET STARTED
SPECIFICATIONS Digi ConnectCore® 93
APPLICATION PROCESSOR NXP® i.MX 93
  • Up to 2x Cortex®-A55 cores at 1.7 GHz
  • 1x Cortex-M33 core at 250 MHz core for real-time processing
MEMORY Up to 32 GB flash (eMMC), up to 2 GB LPDDR4 / LPDDR4X (16-bit)
NPU AI/ML Arm® Ethos U65 micro neural processor
PMIC NXP PCA9451
GRAPHICS / DISPLAY 2D GPU:
  • Blended/composition
  • Resize
  • Color space conversion
1x 1080p 60 MIPI DSI (4-lane, 1.5 Gbps/lane) with PHY
1x 720p 60 LVDS (4-lane)
18-bit parallel RGB
CAMERA 1x 1080p 60 MIPI-CSI (2-lane, 1.5 Gbps/lane) with PHY
8-bit parallel YUV/RGB
SECURITY Digi TrustFence®: secure boot, filesystem encryption, tamper detection, secure JTAG, secure console, secure build environments, secure firmware updates; EdgeLock secure enclave: crypto, tamper detection, secure clock, secure boot, eFuse key storage, random number; Arm TrustZone (Cortex-A and Cortex-M)
PERIPHERALS / INTERFACES 2x USB 2.0 OTG controllers with integrated PHY interfaces
1x Ultra Secure Digital Host Controller (uSDHC) interfaces
8x Low Power Universal Asynchronous Receiver / Transmitter (LPUART) modules
8x Low Power I2C modules, 2x I3C
8x Low Power SPI (LPSPI) modules
2x FlexCAN with flexible data-rate (FD) support
4x pulse-width modulator (PWM) with 16-bit counter
1x 12-bit ADC module with accurate internal voltage reference, up to 4 channels
3x Synchronous Audio Interface (SAI) modules (up to 4 lanes) supporting I2S, AC97, TDM, codec/DSP and DSD interfaces
1x S/PDIF input and output, including a raw capture input mode
8-channel Pulse Density Modulation (PDM) input
Up to 112 GPIOs
ETHERNET 2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN)
WI-FI Wi-Fi 6 802.11ax dual-band 1x1 wireless
BLUETOOTH Bluetooth® 5.2
ON-MODULE MICROCONTROLLER ASSIST Digi Microcontroller Assist™ for advanced power management, security, peripheral support and system reliability
  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes at <2.5 µA
OPERATING TEMPERATURE Industrial: -40 °C to 85 °C (-40 °F to 185 °F); depending on use case and enclosure/system design
STORAGE TEMPERATURE -50 °C to 125 °C (-58 °F to 257 °F)
RELATIVE HUMIDITY 5% to 90% (non-condensing)
RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS / IMMUNITY / SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS 118 castellated vias, LGA-474, 1.27 mm pitch, 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)
PRODUCT WARRANTY 3-year

Recently Viewed