Digi ConnectCore 93

Coming Soon

Embedded, wireless system-on-module based on the NXP i.MX 93 processor, with AI/ML NPU, designed for longevity and scalability in industrial IoT applications

  • Industrial i.MX 93 single/dual-core system-on-module
  • AI/ML Arm® Ethos U65 micro neural processing unit (NPU)
  • Pre-certified dual-band 802.11ax Wi-Fi and Bluetooth® 5.2
  • Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability
  • Superior power management with hardware and software support
  • Digi Microcontroller Assist™ for 2.5 µA ultra-low power mode
  • Seamless cellular modem and Digi XBee® integration
  • High level of pin-compatibility with Digi ConnectCore® 8 SOM family
  • Cloud and edge-compute services integration
  • Built-in device security, identity and privacy with Digi TrustFence®
  • Remote management with Digi ConnectCore® Cloud Services
  • Digi Embedded Yocto Linux® support

Digi ConnectCore® 93, based on the NXP® i.MX 93 application processor, is an integrated system-on-module (SOM) platform with wireless connectivity. The ConnectCore 93 SOM is designed for a wide range of medical, industrial, energy, and transportation applications, including Internet of Things (IoT), automation, human-machine interface (HMI), equipment monitoring, audio/voice, edge computing and machine learning (e.g. anomaly detection).

Digi ConnectCore 93 features up to two power-efficient Arm® Cortex®-A55 cores, with a Cortex-M33 core, AI/ML Arm Ethos U65 NPU and NXP PMIC for maximum power efficiency. This SOM is designed for industrial reliability and the 10+ year product lifecycles of embedded devices.

The ConnectCore SOM solution provides ready-to-use building blocks and a vast collection of development tools. This helps OEMs lower R&D and development costs, realize a lower total cost of ownership, and streamline time-to-market by leveraging pre-certified wireless connectivity, remote management, cloud integration and a complete, embedded Linux software platform based on Yocto Project®.

In addition, built in Digi TrustFence® enables OEM developers to integrate critical security and data privacy capabilities into their products.

TrustFenceYocto ProjectBluetoothWi-Fi AllianceNXP Gold PartnerPowered by AWS


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SKU: CC-WMX93-KIT Digi ConnectCore 93 Development Kit
  • Digi ConnectCore 93 development board with i.MX 93 dual-core, NPU, 8 GB eMMC, 1 GB LPDDR4 wireless SOM
CC-WMX93-KIT Coming Soon
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SKU: CC-WMX-YC7D-KN Digi ConnectCore 93 System-On-Module — dual-core, NPU, wireless
  • NXP i.MX 93
  • 8 GB flash (eMMC)
  • AI/ML Arm Ethos U65 micro neural processor
  • 2x Gigabit Ethernet
  • Wi-Fi 6 802.11ax
  • Bluetooth 5.2
  • 802.4.15
CC-WMX-YC7D-KN Coming Soon
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SKU: CC-MX-YC7D-ZN Digi ConnectCore 93 System-On-Module — dual-core, NPU, Ethernet
  • NXP i.MX 93 
  • 8 GB flash (eMMC)
  • AI/ML Arm Ethos U65 micro neural processor
  • 2x Gigabit Ethernet
CC-MX-YC7D-ZN Coming Soon
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SKU: CC-WMX-ZC6D-L1 Digi ConnectCore 93 System-On-Module — single-core, wireless
  • NXP i.MX 93
  • 8 GB flash (eMMC)
  • 512 MB LPDDR4 / LPDDR4X
  • 2x Gigabit Ethernet
  • Wi-Fi 6 802.11ax
  • Bluetooth 5.2
  • 802.4.15
CC-WMX-ZC6D-L1 Coming Soon
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SKU: CC-MX-ZC6D-Z1 Digi ConnectCore 93 System-On-Module — single-core, Ethernet
  • NXP i.MX 93
  • 8 GB flash (eMMC)
  • 512 MB LPDDR4 / LPDDR4X
  • 2x Gigabit Ethernet
CC-MX-ZC6D-Z1 Coming Soon
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SKU: CC-ACC-LCDH-10 LCD Application Kit, including 10 in WXGA (high resolution) LCD panel CC-ACC-LCDH-10 HOW TO BUY
Services and Support
Digi ConnectCore® Cloud Services enable OEMs in a wide range of industries to create connected devices with remote-dashboard, -service and -application capabilities using Digi ConnectCore system-on-modules (SOMs).   GET STARTED
Maintaining the security for connected devices after product release is challenging. Digi ConnectCore® Security Services enable customers to keep products secure.   GET STARTED
Support Services
Get the help you need to deploy, manage, connect, customize and enhance your Digi solution
SPECIFICATIONS Digi ConnectCore® 93
  • Up to 2x Cortex®-A55 cores at 1.7 GHz
  • 1x Cortex-M33 core at 250 MHz core for real-time processing
MEMORY Up to 32 GB flash (eMMC), up to 2 GB LPDDR4 / LPDDR4X (16-bit)
NPU AI/ML Arm® Ethos U65 micro neural processor
  • Blended/composition
  • Resize
  • Color space conversion
1x 1080p 60 MIPI DSI (4-lane, 1.5 Gbps/lane) with PHY
1x 720p 60 LVDS (4-lane)
18-bit parallel RGB
CAMERA 1x 1080p 60 MIPI-CSI (2-lane, 1.5 Gbps/lane) with PHY
8-bit parallel YUV/RGB
SECURITY Digi TrustFence®: secure boot, filesystem encryption, tamper detection, secure JTAG, secure console, secure build environments, secure firmware updates; EdgeLock secure enclave: crypto, tamper detection, secure clock, secure boot, eFuse key storage, random number; Arm TrustZone (Cortex-A and Cortex-M)
PERIPHERALS / INTERFACES 2x USB 2.0 OTG controllers with integrated PHY interfaces
1x Ultra Secure Digital Host Controller (uSDHC) interfaces
8x Low Power Universal Asynchronous Receiver / Transmitter (LPUART) modules
8x Low Power I2C modules, 2x I3C
8x Low Power SPI (LPSPI) modules
2x FlexCAN with flexible data-rate (FD) support
4x pulse-width modulator (PWM) with 16-bit counter
1x 12-bit ADC module with accurate internal voltage reference, up to 4 channels
3x Synchronous Audio Interface (SAI) modules (up to 4 lanes) supporting I2S, AC97, TDM, codec/DSP and DSD interfaces
1x S/PDIF input and output, including a raw capture input mode
8-channel Pulse Density Modulation (PDM) input
Up to 112 GPIOs
ETHERNET 2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN)
WI-FI Wi-Fi 6 802.11ax dual-band 1x1 wireless
BLUETOOTH Bluetooth® 5.2
ON-MODULE MICROCONTROLLER ASSIST Digi Microcontroller Assist™ for advanced power management, security, peripheral support and system reliability
  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes at <2.5 µA
OPERATING TEMPERATURE Industrial: -40 °C to 85 °C (-40 °F to 185 °F); depending on use case and enclosure/system design
STORAGE TEMPERATURE -50 °C to 125 °C (-58 °F to 257 °F)
RELATIVE HUMIDITY 5% to 90% (non-condensing)
RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS / IMMUNITY / SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS 118 castellated vias, LGA-474, 1.27 mm pitch, 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)

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